Product Center, Comprehensive Quantum Computing Product Support
Product Center
Comprehensive Quantum Computing Product Support
Origin Quantum develops quantum-computing technologies and products across hardware, software, cloud services, security and education. Explore product capabilities and use cases by category, or contact us for product information and consultation.
300 pin Quantum Chip Packaging Module
The 72-qubit quantum chip packaging module refers to the device that connects the signal electrode of quantum chip to the peripheral circuit of the chip and protects the quantum chip. Its main function is to provide the qubits with basic signal connections, good thermal contact, stable ground plane networks, and basic shielding protection.
Features
Supports superconducting quantum chips with up to 180 qubits (packaging modules supporting higher qubit counts can be customized).
The unique structural design effectively improves the decoherence performance of the chip and suppresses crosstalk.
The overall external magnetic field does not exceed 1 nT.
The ground network of the package housing uses superconducting material, providing lower signal transmission delay.
Specifications
| Supported Superconducting Quantum Chip Qubits | Supports up to 180 qubits | ||||
| Chip Sample Size | ≤34mm | ||||
| Channel DC Resistance | ≤0.15Ω(room temperature) | ||||
| Operating Frequency Range | 300KHz-6GHz | 6-8GHz | 8-12GHz | 12-16GHz | 16-20GHz |
| Insertion Loss | ＜8.5dB | ＜12dB | ＜14dB | ＜18dB | ＜14dB |
| Adjacent Channel Crosstalk | ≥52dB | ≥45dB | ≥41dB | ≥40dB | ≥45dB |
| Diagonal Channel Crosstalk | ≥75dB | ≥81dB | ≥73dB | ≥71dB | ≥75dB |
| Remote Channel Crosstalk | ≥92dB | ≥93dB | ≥84dB | ≥79dB | ≥72dB |
| Interface Type | SSMP | ||||
