Product Center, Comprehensive Quantum Computing Product Support
Product Center
Comprehensive Quantum Computing Product Support
Origin Quantum develops quantum-computing technologies and products across hardware, software, cloud services, security and education. Explore product capabilities and use cases by category, or contact us for product information and consultation.
High-Density DC Interconnect Module
The High-Density DC Interconnect Module provides DC signal transmission channels for superconducting quantum chips, low-temperature amplifiers, parametric amplifiers, and other cryogenic devices. This system includes sealed integrated module, heat sink DC integrated module, and DC cable integrated module, ensuring stable cross-temperature DC signal transmission in the ultra-low thermal leakage environment of a dilution refrigerator.
Features
Compatible with 40mm Line Holes: Fully equipped with 24*4 DC channels, customizable for the number of channels.
Heat Sink DC Integrated Module: Customizable spiral winding heat sinks, with a default of 4 sets(A row of silver columns form a set) @ RT-4K and 3 sets @ 4K-MC.
Cable Material: Cu @ RT-4K, NbTi/CuNi mix @ 4K-MC, with the option for pure copper.
Sealing flange vacuum leak rate ≤1×10^-9 Pa·m³/s.
