Product Center, Comprehensive Quantum Computing Product Support

Product Center

Comprehensive Quantum Computing Product Support

Origin Quantum develops quantum-computing technologies and products across hardware, software, cloud services, security and education. Explore product capabilities and use cases by category, or contact us for product information and consultation.

High-Density Microwave Interconnect Module

The High-Density Microwave Interconnect Module mainly provides microwave signal transmission channels for high-qubit quantum chips, and can realize stable transmission of microwave signals across temperature regions in an extremely low heat leakage environment of the dilution refrigerator. Its system components include sealed microwave integrated modules, heat sink microwave integrated modules and transmission line integrated modules. The sealed microwave integrated module can ensure the vacuum environment in which the quantum chip operates; the heat sink microwave integrated module integrates attenuators of different specifications, which can provide good heat conduction for the cross-temperature transmission line integrated module; the transmission line integrated module is an integrated cable with 12 channels.

High-Density Microwave Interconnect Module

Features

01

High channel density, up to 168 cable channels fully equipped (Customized).

02

The heat sink microwave integrated module integrates the attenuator, and the specification of the attenuator can be customized.

03

Both ends of the system adopt SSMP interface, and the cable material is CuNi semi-rigid wire and NbTi semi-rigid wire.

04

The vacuum leak rate of the sealing flange ≤1×10^(-9)Pa·m³/s.